Cif Agp30

Rating :- 8.11 /10

Votes :- 135

of Max Strands x Strand Size:64 x 0.15mm; Primary Conductor Resistance:15.66Mohm-m; Reel Length (Imperial):82ft; Reel Length (Metric):25m

WIRE BRAID, COPPER BONDING, 15A, 25M; Sleeving / Tubing Type:Braided; Sleeving Material:Copper, Tin Plated; Sleeving Colour:Tin; Internal Diameter:-; Length - Metric:25m; Length - Imperial:82ft; Product Range:-; SVHC:No SVHC (15-Jan-2018); Accessory Type:Braid; Approval Category:BS EN 13602; Body Material:Copper; Colour:Tin; Conductor Area CSA:1.13mmÂ²; Conductor Make-up:64 / 0. Pro Power Pp-Fb-15A.75mm; No.

Acessórios para eletrônicos

Gerenciamento de cabos

Cable,Wire & Cable Assemblies

PRO POWER

of Max Strands x Strand Size:64 x 0.1mm; Primary Conductor Resistance:40.07Mohm-m; Reel Length (Imperial):82ft; Reel Length (Metric):25m

5mmÂ²; Conductor Make-up:64 / 0.5mm; No. Pro Power Pp-Fb-10A.

Acessórios para eletrônicos

Gerenciamento de cabos

Cable,Wire & Cable Assemblies

PRO POWER

of Pins:3Pins; Operating Temperature Max:150Â°C; Product Range:-; Automotive Qualification Standard:-; MSL:MSL 1 - Unlimited; SVHC:No SVHC (15-Jan-2019); Collector Emitter Saturation Voltage Vce(on):95mV; Continuous Collector Current Ic Max:2.5A; Current Gain Hfe Max:900; Current Ic Continuous a Max:2.5A; Current Ic hFE:10mA; Current Ic hfe -Do Not Use See ID 1182:10mA; DC Current Gain Hfe Max:900; DC Current Gain Hfe Min:300; Gain Bandwidth ft Typ:175MHz; Hfe Min:300; Hfe Typ:450; Operating Temperature Min:-55Â°C; Operating Temperature Range:-55Â°C to +150Â°C; Power Dissipation Ptot Max:1.25W; Termination Type:Surface Mount Device; Voltage Vcbo:180V

Diodes Inc.

Semiconductors - Discretes

Semicondutores

DIODES INC.

Multicomp 2143

POWER ENTRY CONNECTOR; Connector Type:IEC; Current Rating:15A; Connector Colour:Black; Connector Body Material:Nylon (Polyamide) Body; Voltage Rating VAC:125V; Product Range:-; Connector Mounting:Panel Mount; Gender:Receptacle.

Connectors

MULTICOMP

Cif Al441

7mm); Pitch Spacing:0.4mm; Row Pitch:1.27mm.

Cif Al436

54mm.5mm); Pitch Spacing:1.35mm; External Height:100mm; External Width:160mm; Board Thickness:-; SVHC:No SVHC (15-Jan-2019); External Length / Height:100mm; Hole Pitch:1.TESTBOARD, SMC, PROTOTYPE, 100X160 1.

Cif Al435

27mm; Material:Epoxy (0.27mm; Row Pitch:2.

of Copper Coated Sides:1; Pitch Spacing:2.54mm; Row Pitch:0.54mm

54mm; Material:Fibreglass Epoxy; No. Cif Agp30.57mm; SVHC:No SVHC (15-Jan-2019); External Length / Height:160mm; Hole Pitch:2.PAD, PROTOBOARD, 160X300, 1F; Board Type:Matrix Board; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:160mm; External Width:300mm; Board Thickness:1.

Cif Al435

7mm); Pitch Spacing:1.TESTBOARD, SMC, PROTOTYPE, 53X95, 0.7MM; Board Type:Matrix Board; Board Material:Epoxy; Hole Diameter:1mm; External Height:53mm; External Width:95mm; Board Thickness:0.

of Copper Coated Sides:1; Pitch Spacing:2.54mm; Row Pitch:0.54mm

54mm; Material:Fibreglass Epoxy; No.PAD, PROTOBOARD, 160X300, 1F; Board Type:Matrix Board; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:160mm; External Width:300mm; Board Thickness:1.