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Boyd Ml524-30-B

About The 26°C/W; Packages Cooled:TO-218, TO-247; External Width - Metric:35mm; External Height - Metric:35mm; External Length - Metric:22mm; External Diameter - Metric:-; Heat Sink Material:-; External Width - Imperial:1.38"; External Length - Imperial:0

HEAT SINK BIG CHIEF TO247/218; Thermal Resistance:6.26°C/W; Packages Cooled:TO-218, TO-247; External Width - Metric:35mm; External Height - Metric:35mm; External Length - Metric:22mm; External Diameter - Metric:-; Heat Sink Material:-; External Width - Imperial:1.38"; External Height - Imperial:1.38"; External Length - Imperial:0.87"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019)

Cooling & Thermal Management

Boyd Ml524-30-B

Cooling & Thermal Management

Specifications of Boyd Ml524-30-B

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Boyd Ml524-30-B
More Varieties

Rating :- 8.07 /10
Votes :- 139
Multicomp Pro Ed-016

Multicomp Pro Ed-016

EDGING GROMMET, 1.6MM, 10M; Grommet Type:Solid Edging; Cable Diameter Min:-; Cable Diameter Max:-; Grommet Material:PE (Polyethylene); Mounting Hole Dia:-; Panel Thickness Max:1.2mm; Reel Length (Imperial):33ft; Reel Length (Metric):10m.6mm; Material:PE; Panel Thickness Min:1.

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  • MULTICOMP PRO
    • Multicomp Pro Ed-010

    Multicomp Pro Ed-010

    EDGING GROMMET, 1MM, 10M; Grommet Type:Solid Edging; Cable Diameter Min:-; Cable Diameter Max:-; Grommet Material:PE (Polyethylene); Mounting Hole Dia:-; Panel Thickness Max:1mm; Grommet Colour:Natural; Product Range:-; SVHC:No SVHC (17-Dec-2015); Accessory Type:Grommet; Body Material:PE (Polyethylene); Colour:Natural; External Width:3.6mm; Material:PE; Reel Length (Imperial):33ft; Reel Length (Metric):10m.

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  • MULTICOMP PRO
    • of ADC Inputs:8; No.

    of ADC Inputs:8; No.

    Microchip Atmega128A-Mu MCU, 8BIT, ATMEGA, 16MHZ, QFN-64; Product Range:AVR ATmega Family ATmega128 Series Microcontrollers; CPU Speed:16MHz; Program Memory Size:128KB; RAM Memory Size:4KB; No.

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  • Semicondutores
  • Semiconductors - ICs
  • MICROCHIP
    • of ADC Inputs:8; No.

    of ADC Inputs:8; No.

    of I/O's:53I/O's; Embedded Interface Type:I2C, SPI, UART; Supply Voltage Min:2.

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  • Componentes e placas de circuitos
  • Semicondutores
  • Semiconductors - ICs
  • MICROCHIP
    • Boyd Os515-100-B

    Boyd Os515-100-B

    18"; External Height - Imperial:1.94"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019).03°C/W; Packages Cooled:TO-218, TO-220, TO-251, TO-262, TO-273; External Width - Metric:30mm; External Height - Metric:45mm; External Length - Metric:100mm; External Diameter - Metric:-; Heat Sink Material:-; External Width - Imperial:1.HEAT SINK MAX CLIP - STANDARD 100MM; Thermal Resistance:3.

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    • Boyd 0S509-140-U

    Boyd 0S509-140-U

    51"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019).9"; External Height - Imperial:2.

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  • Cooling & Thermal Management
  • BOYD
    • Boyd Ml524-30-B

    Boyd Ml524-30-B

    HEAT SINK BIG CHIEF TO247/218; Thermal Resistance:6.87"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019).38"; External Length - Imperial:0.38"; External Height - Imperial:1.

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    • Boyd 416601U00000G

    Boyd 416601U00000G

    LIQUID COLD PLATE; Thermal Resistance:0.69"; External Length - Imperial:12"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019).005°C/W; Packages Cooled:-; External Width - Metric:127mm; External Height - Metric:17.

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  • Cooling & Thermal Management
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    • Boyd Ml524-30-B

    Boyd Ml524-30-B

    HEAT SINK BIG CHIEF TO247/218; Thermal Resistance:6.

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  • Cooling & Thermal Management
  • BOYD
    • Boyd 416601U00000G

    Boyd 416601U00000G

    69"; External Length - Imperial:12"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019).4mm; External Length - Metric:305mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper; External Width - Imperial:5"; External Height - Imperial:0.005°C/W; Packages Cooled:-; External Width - Metric:127mm; External Height - Metric:17.

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