of Copper Coated Sides:1; No. of Holes:2400; PCB Size:114.30 x 165.10 mm (4.5 x 6.5 "); Pad Area:2.00 mm²; Pitch Spacing:2.54mm PCB, PROTOTYPE, RE230-LF; Board Type:Matrix Board; Board Material:Epoxy Glass Composite; Hole Diameter:1.02mm; External Height:114.3mm; External Width:165.1mm; Board Thickness:1.6mm; SVHC:No SVHC (15-Jan-2019); Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:114.3mm; Hole Matrix:40 x 60; Hole Pitch:2.54mm; Material:Epoxied FR4; No.
Tools & Production Supplies
Roth Elektronik Re230-Lf
Specifications of Roth Elektronik Re230-Lf | |
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Category | Eletrônicos > Componentes e placas de circuitos > Prototipação de circuitos > Tábuas para pão |
Instock | instock |
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